SLLSEY7F June   2017  – April 2020 ISO1211 , ISO1212

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.          Application Diagram
      2.      ISO121x Devices Reduce Board Temperatures vs Traditional Solutions
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—DC Specification
    10. 6.10 Switching Characteristics—AC Specification
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Test Circuits
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Sinking Inputs
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting Current Limit and Voltage Thresholds
          2. 9.2.1.2.2 Thermal Considerations
          3. 9.2.1.2.3 Designing for 48-V Systems
          4. 9.2.1.2.4 Designing for Input Voltages Greater Than 60 V
          5. 9.2.1.2.5 Surge, ESD, and EFT Tests
          6. 9.2.1.2.6 Multiplexing the Interface to the Host Controller
          7. 9.2.1.2.7 Status LEDs
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Sourcing Inputs
      3. 9.2.3 Sourcing and Sinking Inputs (Bidirectional Inputs)
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resource
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Feature Description

The ISO121x devices receive 24-V to 60-V digital input signals and provide isolated digital outputs. An external resistor, RSENSE, connected between the INx and SENSEx pins, sets the limit for the current drawn from the field input. Internal voltage comparators connected to the SENSEx pins determine the input-voltage transition thresholds.

The output buffers on the control side are capable of providing enough current to drive status LEDs. The EN pin is used to enable the output buffers. A low state on the EN pin puts the output buffers in a high-impedance state.

The ISO121x devices are capable of operating up to 4 Mbps. Both devices support an isolation withstand voltage of 2500 VRMS between side 1 and side 2. Table 1 provides an overview of the device features.

Table 1. Device Features

PART NUMBER CHANNELS MAXIMUM DATA RATE PACKAGE RATED ISOLATION
ISO1211 1 4 Mbps 8-pin SOIC (D) 2500 VRMS,
3600 VPK
ISO1212 2 4 Mbps 16-pin SSOP (DBQ) 2500 VRMS,
3600 VPK