SBOS074E September   1997  – June 2018 ISO124

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Modulator
      2. 7.1.2 Demodulator
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Isolation Amplifier
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Carrier Frequency Considerations
      2. 8.1.2 Isolation Mode Voltage Induced Errors
      3. 8.1.3 High IMV dV/dt Errors
      4. 8.1.4 High Voltage Testing
    2. 8.2 Typical Applications
      1. 8.2.1 Output Filters
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Battery Monitor
      3. 8.2.3 Programmable Gain Amplifier
      4. 8.2.4 Thermocouple Amplifier
      5. 8.2.5 Isolated 4-mA to 20-mA Instrument Loop
      6. 8.2.6 Single-Supply Operation of the ISO124 Isolation Amplifier
      7. 8.2.7 Input-Side Powered ISO Amplifier
      8. 8.2.8 Powered ISO Amplifier With Three-Port Isolation
  9. 9 Power Supply Recommendations
    1. 9.1 Signal and Supply Connections
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NVF|8
  • DVA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (July 2016) to E Revision

  • Changed 16-pin SOIC package to 16-pin PDIP package to match content shown in package option addendum at the end of the data sheetGo
  • Changed DVA and NVF pin configuration labels to match content shown in the package option addendum at the end of the data sheetGo
  • Changed parameter name from "vs temperature" to "Input offset drift" in Electrical Characteristics tableGo
  • Changed parameter name from "vs power supply" to "Power-supply rejection ratio" in Electrical Characteristics tableGo
  • Changed location of supply voltage specifications from the Electrical Characteristics table to the Recommended Operating Conditions tableGo
  • Changed parameter name from "Quiescent current" to "High-side analog supply current", and changed symbol from "VS1" to "IVS1" in Electrical Characteristics tableGo
  • Changed parameter name from "Quiescent current" to "Low-side analog supply current", and changed symbol from "VS2" to "IVS2" in Electrical Characteristics tableGo
  • Changed location of Temperature specifications from the Electrical Characteristics table to the Recommended Operating Conditions tableGo
  • Deleted Thermal resistance parameters from Electrical Characteristics table; see Thermal Information tableGo

Changes from C Revision (September 2005) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go