SLLSEX0D November   2016  – December 2022 ISO1540-Q1 , ISO1541-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Supply Current Characteristics
    11. 6.11 Timing Requirements
    12. 6.12 Switching Characteristics
    13. 6.13 Insulation Characteristics Curves
    14. 6.14 Typical Characteristics
      1.      Parameter Measurement Information
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Isolator Functional Principle
      1. 7.4.1 Receive Direction (Left Diagram of )
      2. 7.4.2 Transmit Direction (Right Diagram of )
    5. 7.5 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 I2C Bus Overview
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Recommended Operating Conditions

MINMAXUNIT
VCC1, VCC2Supply voltage35.5V
VSDA1, VSCL1Input and output signal voltages, side 10VCC1V
VSDA2, VSCL2Input and output signal voltages, side 20VCC2V
VIL1Low-level input voltage, side 100.5V
VIH1High-level input voltage, side 10.7 × VCC1VCC1V
VIL2Low-level input voltage, side 200.3 × VCC2V
VIH2High-level input voltage, side 20.7 × VCC2VCC2V
IOL1Output current, side 10.53.5mA
IOL2Output current, side 20.535mA
C1Capacitive load, side 140pF
C2Capacitive load, side 2400pF
fMAXOperating frequency(1)1MHz
TAAmbient temperature–40125°C
TJJunction temperature–40136°C
TSDThermal shutdown139197°C
This represents the maximum frequency with the maximum bus load (C) and the maximum current sink (IO). If the system has less bus capacitance, then higher frequencies can be achieved.