SLLSFF5H January   2020  – May 2022 ISO6720-Q1 , ISO6721-Q1 , ISO6721R-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6.     Insulation Specifications
    7. 7.6  Safety-Related Certifications
    8. 7.7  Safety Limiting Values
    9.     Electrical Characteristics—5-V Supply
    10. 7.8  Supply Current Characteristics—5-V Supply
    11. 7.9  Electrical Characteristics—3.3-V Supply
    12. 7.10 Supply Current Characteristics—3.3-V Supply
    13. 7.11 Electrical Characteristics—2.5-V Supply 
    14. 7.12 Supply Current Characteristics—2.5-V Supply
    15.     Electrical Characteristics—1.8-V Supply
    16. 7.13 Supply Current Characteristics—1.8-V Supply
    17. 7.14 Switching Characteristics—5-V Supply
    18. 7.15 Switching Characteristics—3.3-V Supply
    19. 7.16 Switching Characteristics—2.5-V Supply
    20. 7.17 Switching Characteristics—1.8-V Supply
    21. 7.18 Insulation Characteristics Curves
    22. 7.19 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
    2. 14.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC (1) ISO672x ISO672xB ISO6721RB UNIT
DWV (SOIC) D (SOIC) D (SOIC)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 84.3 104.6 98.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36.3 48.9 33.8 °C/W
RθJB Junction-to-board thermal resistance 47.0 52.9 47 °C/W
ψJT Junction-to-top characterization parameter 7.4 7.9 2.3 °C/W
ψJB Junction-to-board characterization parameter 45.1 52.1 46.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.