SLLSFG4E December   2019  – May 2022 ISO6740-Q1 , ISO6741-Q1 , ISO6742-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9.     Electrical Characteristics—5-V Supply
    10. 7.9  Supply Current Characteristics—5-V Supply
    11. 7.10 Electrical Characteristics—3.3-V Supply
    12. 7.11 Supply Current Characteristics—3.3-V Supply
    13. 7.12 Electrical Characteristics—2.5-V Supply 
    14. 7.13 Supply Current Characteristics—2.5-V Supply
    15.     Electrical Characteristics—1.8-V Supply
    16. 7.14 Supply Current Characteristics—1.8-V Supply
    17. 7.15 Switching Characteristics—5-V Supply
    18. 7.16 Switching Characteristics—3.3-V Supply
    19. 7.17 Switching Characteristics—2.5-V Supply
    20. 7.18 Switching Characteristics—1.8-V Supply
    21. 7.19 Insulation Characteristics Curves
    22. 7.20 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
    2. 14.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14.1 Package Option Addendum

Packaging Information

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish(6) MSL Peak Temp(3) Op Temp (°C) Device Marking(4)(5)
ISO6740QDWRQ1 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6740
ISO6740FQDWRQ1 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6740F
ISO6741QDWRQ1 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6741
ISO6741FQDWRQ1 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6741F
ISO6742QDWRQ1 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6742
ISO6742FQDWRQ1 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6742F