SLLSFG4E December 2019 – May 2022 ISO6740-Q1 , ISO6741-Q1 , ISO6742-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | ISO674x | UNIT | |
---|---|---|---|
DW (SOIC) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 73 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 36.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 40.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 17 | °C/W |
ψJB | Junction-to-board characterization parameter | 39.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |