SLLSF54D October   2017  – March 2020 ISO7041

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Schematic
      2.      Data Rate vs Power Consumption at 3.3 V
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics 5V Supply
    10. 7.10 Supply Current Characteristics 5V Supply
    11. 7.11 Electrical Characteristics 3.3V Supply
    12. 7.12 Supply Current Characteristics 3.3V Supply
    13. 7.13 Electrical Characteristics 2.5V Supply
    14. 7.14 Supply Current Characteristics 2.5V Supply
    15. 7.15 Electrical Characteristics 1.8V Supply
    16. 7.16 Supply Current Characteristics 1.8V Supply
    17. 7.17 Switching Characteristics
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Refresh Enable
      2. 9.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Insulation Lifetime
      2. 10.1.2 Intrinsic Safety
        1. 10.1.2.1 Schedule of Limitations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resource
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
16-QSOP PACKAGE
IS Safety input, output, or supply current RθJA = 87°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C 261 mA
RθJA = 87°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C 399 mA
RθJA = 87°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C 522
RθJA = 87°C/W, VI = 1.89 V, TJ = 150°C, TA = 25°C 760 mA
PS Safety input, output, or total power RθJA = 87°C/W, TJ = 150°C, TA = 25°C 1435 mW
TS Maximum safety temperature 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA. 

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.