SLLSF54D October   2017  – March 2020 ISO7041

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Schematic
      2.      Data Rate vs Power Consumption at 3.3 V
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics 5V Supply
    10. 7.10 Supply Current Characteristics 5V Supply
    11. 7.11 Electrical Characteristics 3.3V Supply
    12. 7.12 Supply Current Characteristics 3.3V Supply
    13. 7.13 Electrical Characteristics 2.5V Supply
    14. 7.14 Supply Current Characteristics 2.5V Supply
    15. 7.15 Electrical Characteristics 1.8V Supply
    16. 7.16 Supply Current Characteristics 1.8V Supply
    17. 7.17 Switching Characteristics
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Refresh Enable
      2. 9.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Insulation Lifetime
      2. 10.1.2 Intrinsic Safety
        1. 10.1.2.1 Schedule of Limitations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resource
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.2.1 Schedule of Limitations

These components are certified to comply with IEC 60079-0, Edition 7, IEC 60079-11, Edition 6, EN 60079-0:2018 and EN 60070-11:2012. When one of these components is used in an equipment, the component is to be soldered on a PCB inside a suitable enclosure and re-evaluated as an equipment. The operating temperature range of these components is -55°C to +85°C. The creepage and clearance distances across the isolating component have been evaluated, but the distance to other circuitry remain the responsibility of the user of the final equipment.

This assembly is an isolating component between separate intrinsically safe circuits. The assembly must be connected to suitably certified intrinsically safe circuits considering the entity parameters and temperature ratings in the two different application scenarios shown in Table 3.

Table 3. Entity Parameters and Temperature Ratings

APPLICATION ENTITY PARAMETERS SIDE 1 ENTITY PARAMETERS SIDE 2 AMBIENT TEMPERATURE RANGE MAXIMUM COMPONENT TEMPERATURE
IS to IS: Case 1 Ui = 50 V Ui = 50 V -55°C to +70°C 194.3°C
Ii = 300 mA Ii = 300 mA
Pi = 1.3 W Pi = 1.3 W
Li = 0 H Li = 0 H
Ci = 4 pF Ci = 4 pF
IS to IS: Case 2 Ui = 50 V Ui = 50 V -55°C to +85°C 183.1°C
Ii = 300 mA Ii = 300 mA
Pi = 1.1 W Pi = 1.1 W
Li = 0 H Li = 0 H
Ci = 4 pF Ci = 4 pF