SLLS755Q July   2006  – January 2021 ISO7220A , ISO7220B , ISO7220C , ISO7220M , ISO7221A , ISO7221B , ISO7221C , ISO7221M

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V VCC1 and VCC2 Supplies
    10. 6.10 Electrical Characteristics—5-V VCC1 and 3.3-V VCC2 Supply
    11. 6.11 Electrical Characteristics—3.3-V VCC1 and 5-V VCC2 Supply
    12. 6.12 Electrical Characteristics—3.3-V VCC1 and VCC2 Supplies
    13. 6.13 Electrical Characteristics—2.8-V VCC1 and VCC2 Supplies
    14. 6.14 Switching Characteristics—5-V VCC1 and VCC2 Supplies
    15. 6.15 Switching Characteristics—5-V VCC1 and 3.3-V VCC2 Supply
    16. 6.16 Switching Characteristics—3.3-VCC1 and 5-V VCC2 Supplies
    17. 6.17 Switching Characteristics—3.3-V VCC1 and VCC2 Supplies
    18. 6.18 Switching Characteristics—2.8-V VCC1 and VCC2 Supplies
    19. 6.19 Insulation Characteristics Curves
    20. 6.20 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics—3.3-V VCC1 and VCC2 Supplies

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
tPLH, tPHLPropagation delayISO722xA, see Figure 7-1290400610ns
PWDPulse-width distortion |tPHL – tPLH|(1)122ns
tPLH, tPHLPropagation delayISO722xB, see Figure 7-1466278ns
PWDPulse-width distortion |tPHL – tPLH|(1)14ns
tPLH, tPHLPropagation delayISO722xC, see Figure 7-1264052ns
PWDPulse-width distortion |tPHL – tPLH|(1)13ns
tPLH, tPHLPropagation delayISO722xM, see Figure 7-181625ns
PWDPulse-width distortion |tPHL – tPLH|(1)0.51ns
tsk(pp)Part-to-part skew(2)ISO722xA190ns
ISO722xB17
ISO722xC10
ISO722xM5
tsk(o)Channel-to-channel output skew (3)ISO7220A315ns
ISO7220B0.63
ISO7220C, ISO7220M0.21
trOutput signal rise timeSee Figure 7-12ns
tfOutput signal fall time2ns
tfsFailsafe output delay time from input power lossSee Figure 7-23μs
tjit(pp)Peak-to-peak eye-pattern jitterISO722xM, 150 Mbps PRBS NRZ data, 5-bit max same polarity input, both channels, See Figure 7-4, Figure 6-131ns
ISO722xM, 150 Mbps unrestricted bit run length data input, both channels, See Figure 7-42
Also referred to as pulse skew.
tsk(pp) is the magnitude of the difference in propagation delay times between any specified pins of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads.