SLLS755P July   2006  – August 2018 ISO7220A , ISO7220B , ISO7220C , ISO7220M , ISO7221A , ISO7221B , ISO7221C , ISO7221M

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V VCC1 and V CC2 Supplies
    10. 6.10 Electrical Characteristics—5-V VCC1 and 3.3-V VCC2 Supply
    11. 6.11 Electrical Characteristics—3.3-V VCC1 and 5-V VCC2 Supply
    12. 6.12 Electrical Characteristics—3.3-V VCC1 and VCC2 Supplies
    13. 6.13 Electrical Characteristics—2.8-V VCC1 and VCC2 Supplies
    14. 6.14 Switching Characteristics—5-V VCC1 and VCC2 Supplies
    15. 6.15 Switching Characteristics—5-V VCC1 and 3.3-V VCC2 Supply
    16. 6.16 Switching Characteristics—3.3-V CC1 and 5-V VCC2 Supplies
    17. 6.17 Switching Characteristics—3.3-V VCC1 and VCC2 Supplies
    18. 6.18 Switching Characteristics—2.8-V VCC1 and VCC2 Supplies
    19. 6.19 Insulation Characteristics Curves
    20. 6.20 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current RθJA = 212°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C, see Figure 1 124 mA
RθJA = 212°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C, see Figure 1 190
TS Safety temperature 150 °C
The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.