SLLS629L January   2006  – October 2015 ISO721 , ISO721M , ISO722 , ISO722M

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics, 5 V
    6. 7.6  Electrical Characteristics, 5 V, 3.3 V
    7. 7.7  Electrical Characteristics, 3.3 V, 5 V
    8. 7.8  Electrical Characteristics, 3.3 V
    9. 7.9  Power Dissipation
    10. 7.10 Switching Characteristics, 5 V
    11. 7.11 Switching Characteristics, 5 V, 3.3 V
    12. 7.12 Switching Characteristics, 3.3 V, 5 V
    13. 7.13 Switching Characteristics, 3.3 V
    14. 7.14 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Features Description
      1. 9.3.1 Insulation Characteristics
      2. 9.3.2 IEC 60664-1 Ratings Table
      3. 9.3.3 Regulatory Information
      4. 9.3.4 Package Insulation Characteristics
      5. 9.3.5 Safety Limiting Values
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematic
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from K Revision (February 2012) to L Revision

Changes from J Revision (July 2010) to K Revision

  • Added ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable InformationGo
  • Changed the Title From: 3.3-V / 5-V High-Speed Digital Isolators To: ISO72x Single Channel High-Speed Digital IsolatorsGo
  • Changed the Features List Go
  • Changed the second paragraph of the Description From: "4000 V" To: "4000 VPK per VDE..."Go
  • Changed the Thermal Information tableGo
  • Changed Figure 1Go
  • Changed the Basic isolation group Specification From: IIIa To: II in IEC 60664-1 Ratings TableGo
  • Changed VDE text From: "DIN EN 60747-5-5 (VDE 0884-5)" To: "DIN V VDE V 0884-10 (VDE V 0884-10):2006-12" in the Regulatory Information tableGo
  • Changed CSA File number: 1698195 To: 220991 in the Regulatory Information tableGo
  • Changed the CTI MIN value From: ≥ 175 V To: 400 V in the Package Insulation Characteristics table.Go
  • Changed RIO Test Condition From: TA < 100°C To: TA = 25°C in Package Insulation Characteristics Go
  • Moved the RIO values from the TYP column to the MIN column of Package Insulation Characteristics Go
  • Changed the title of Figure 16 From: θJC Thermal Derating Curve per DIN EN 60747-5-5 To: θJC Thermal Derating Curve per VDEGo
  • Changed Table 1, added row X, PD, X, UndeterminedGo
  • Changed Table 2, added row X, PD, X, UndeterminedGo
  • Changed Figure 17 Go

Changes from I Revision (February 2010) to J Revision

Changes from H Revision (June 2009) to I Revision

  • Changed Features From: 50 kV/s Transient Immunity, Typical To: 50 kV/µs Transient Immunity, TypicalGo

Changes from G Revision (December 2008) to H Revision

Changes from F Revision (November 2008) to G Revision

  • Changed the Features List From: 4000-V(peak) Isolation To: 4000-V(peak) Isolation, 560-Vpeak VIORMGo

Changes from E Revision (May 2008) to F Revision

  • Changed Figure 19 text From: 20 mm max. from VCC1 To: 2 mm max. from VCC1Go
  • Changed Note in Table 3 From: The ISO72x pin 1 and pin 3 are internally connected together. Either or both may be used as VCC1. To: Pin 1 should be used as VCC1. Pin 3 may also be used as VCC1 or left open as long as Pin 1 is connected to VCC1 Go
  • Changed Note in Table 3 From: The ISO721 and ISO721M pin 5 and pin 7 are internally connected together. Either or both may be used as GND2. To: Pin 5 should be used as GND2. Pin 7 may also be used as GND2 or left open as long as Pin 5 is connected to GND2.Go

Changes from D Revision (February 2007) to E Revision