SLLS867K September   2007  – October 2015 ISO7230C , ISO7230M , ISO7231C , ISO7231M

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: VCC1 and VCC2 at 5-V
    6. 7.6  Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    7. 7.7  Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V
    8. 7.8  Electrical Characteristics: VCC1 and VCC2 at 3.3 V
    9. 7.9  Power Dissipation Characteristics
    10. 7.10 Switching Characteristics: VCC1 and VCC2 at 5-V
    11. 7.11 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    12. 7.12 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V
    13. 7.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V
    14. 7.14 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Package Insulation and Safety-Related Specifications
      2. 9.3.2 Insulation Characteristics
      3. 9.3.3 Regulatory Information
      4. 9.3.4 Safety Limiting Values
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from J Revision (May 2015) to K Revision

Changes from I Revision (January 2011) to J Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Updated Thermal Information Go
  • Updated Regulatory InformationGo

Changes from H Revision (December 2009) to I Revision

Changes from G Revision (September 2009) to H Revision

Changes from F Revision (December 2008) to G Revision

  • Added IEC 60950-1 and CSA Approved to the Features listGo

Changes from E Revision (June 2008) to F Revision

Changes from D Revision (May 2008) to E Revision

  • Added Note: For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For the 3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V.Go
  • Added Note: For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For the 3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V.Go
  • Added Note: For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For the 3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V.Go
  • Added Note: For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For the 3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V.Go
  • Added Note: For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For the 3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V.Go

Changes from C Revision (April 2008) to D Revision

  • Changed Features bullet 4000-Vpeak Isolation to the Features listGo
  • Added tsk(pp) Part-to-part skewGo
  • Added tsk(pp) Part-to-part skewGo
  • Added tsk(pp) Part-to-part skewGo
  • Added tsk(pp) Part-to-part skewGo

Changes from B Revision (April 2008) to C Revision

Changes from A Revision (December 2007) to B Revision

  • Changed Supply Voltage of the ROC Table From: 3.45 To: 3.6 Go

Changes from * Revision (September 2007) to A Revision

  • Deleted Product Preview noteGo
  • Changed TBD to actual valuesGo
  • Changed VCC – 0.4 To: VCC – 0.8Go
  • Changed CI - Typical value from 1 To: 2Go
  • Changed CI - Typical value from 1 To: 2Go
  • Changed CI - Typical value from 1 To: 2Go
  • Changed CI - Typical value from 1 To: 2Go
  • Changed Propagation delay max From: 22 To: 23Go
  • Changed Propagation delay max From: 46 To: 50Go
  • Changed Propagation delay max From: 28 To: 29Go
  • Changed Propagation delay max From: 26 To: 30Go
  • Changed Propagation delay max From: 32 To: 34Go
  • Changed CIO - Typical value from 1 To: 2Go