SLLSEU0C November   2016  – February 2020 ISO7740-Q1 , ISO7741-Q1 , ISO7742-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Description Continued
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Rating
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Supply
    10. 7.10 Supply Current Characteristics—5-V Supply
    11. 7.11 Electrical Characteristics—3.3-V Supply
    12. 7.12 Supply Current Characteristics—3.3-V Supply
    13. 7.13 Electrical Characteristics—2.5-V Supply
    14. 7.14 Supply Current Characteristics—2.5-V Supply
    15. 7.15 Switching Characteristics—5-V Supply
    16. 7.16 Switching Characteristics—3.3-V Supply
    17. 7.17 Switching Characteristics—2.5-V Supply
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description Continued

The ISO774x-Q1 devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier. These devices come with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption. The ISO7740-Q1 device has all four channels in the same direction, the ISO7741-Q1 device has three forward and one reverse-direction channels, and the ISO7742-Q1 device has two forward and two reverse-direction channels. If the input power or signal is lost, default output is high for devices without suffix F and low for devices with suffix F. See the Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, these devices help prevent noise currents on data buses, such as CAN and LIN, or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of the ISO774x-Q1 deviceshave been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO774x-Q1 devicesare available in 16-pin wide SOIC (DW) and QSOP (DBQ) packages. ISO7741-Q1 is also available in extra-wide SOIC (DWW) package.