SLLSEU0C November   2016  – February 2020 ISO7740-Q1 , ISO7741-Q1 , ISO7742-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Description Continued
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Rating
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Supply
    10. 7.10 Supply Current Characteristics—5-V Supply
    11. 7.11 Electrical Characteristics—3.3-V Supply
    12. 7.12 Supply Current Characteristics—3.3-V Supply
    13. 7.13 Electrical Characteristics—2.5-V Supply
    14. 7.14 Supply Current Characteristics—2.5-V Supply
    15. 7.15 Switching Characteristics—5-V Supply
    16. 7.16 Switching Characteristics—3.3-V Supply
    17. 7.17 Switching Characteristics—2.5-V Supply
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics—2.5-V Supply

VCC1 = VCC2 = 2.5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 17 7.5 12 18.5 ns
PWD Pulse width distortion(1) |tPHL – tPLH| 0.2 5.1 ns
tsk(o) Channel-to-channel output skew time(2) Same-direction Channels 4.1 ns
tsk(pp) Part-to-part skew time(3) 4.6 ns
tr Output signal rise time See Figure 17 1 3.5 ns
tf Output signal fall time 1 3.5 ns
tPHZ Disable propagation delay, high-to-high impedance output See Figure 18 22 40 ns
tPLZ Disable propagation delay, low-to-high impedance output 22 40 ns
tPZH Enable propagation delay, high impedance-to-high output for ISO774x-Q1 18 40 ns
Enable propagation delay, high impedance-to-high output for ISO774x-Q1 with F suffix 3.3 8.5 μs
tPZL Enable propagation delay, high impedance-to-low output for ISO774x-Q1 3.3 8.5 μs
Enable propagation delay, high impedance-to-low output for ISO774x-Q1 with F suffix 18 40 ns
tDO Default output delay time from input power loss Measured from the time VCC goes below 1.7 V. See Figure 20 0.1 0.3 μs
tie Time interval error 216 – 1 PRBS data at 100 Mbps 0.7 ns
Also known as pulse skew.
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.