SNOS412O February   2000  – June 2020 LM1117

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Adjustable Output Regulator
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 LM1117 Electrical Characteristics
    6. 7.6 LM1117I Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Load Regulation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Protection Diodes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 External Capacitors
          1. 9.2.2.1.1 Input Bypass Capacitor
          2. 9.2.2.1.2 Adjust Terminal Bypass Capacitor
          3. 9.2.2.1.3 Output Capacitor
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Heatsink Requirements
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) LM1117, LM1117I UNIT
DCY
(SOT-223)
NDE
(TO-220)
NDP
(TO-252)
NGN
(WSON)
KTT
(TO-263)
4 PINS 3 PINS 3 PINS 8 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 61.6 23.8 45.1 39.3 41.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.5 16.6 52.1 31.4 44.1 °C/W
RθJB Junction-to-board thermal resistance 10.4 5.3 29.8 16.5 24.2 °C/W
ψJT Junction-to-top characterization parameter 2.9 3.1 4.5 0.3 10.9 °C/W
ψJB Junction-to-board characterization parameter 10.3 5.3 29.4 16.7 23.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.5 1.3 5.6 1.3 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.