SNLS384G February   1995  – June 2015 LM1881

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics LM1881
    5. 6.5 Dissipation Ratings
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Composite Sync Output
      2. 7.3.2 Vertical Sync Output
      3. 7.3.3 Odd and Even Field Pulse
      4. 7.3.4 Burst or Back Porch Output Pulse
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Video Line Selector
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Multiple Contiguous Video Line Selector With Black Level Restoration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Device and Documentation Support
    1. 10.1 Community Resources
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(3)
MIN MAX UNIT
Supply Voltage 13.2 V
Input Voltage 3 VP-P (VCC = 5) 6 VP-P (VCC ≥ 8) V
Output Sink Currents; Pins, 1, 3, 5 5 mA
Output Sink Current; Pin 7 2 mA
Soldering Information PDIP Package (10 sec.) 260 °C
SOIC Package Vapor Phase (60 sec.) 215
Infrared (15 sec.) 220
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For operation in ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a package thermal resistance of 110°C/W, junction to ambient.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Machine Model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
TA Operating free-air temperature 0 70 °C

6.4 Electrical Characteristics LM1881

VCC = 5 V; RSET = 680 kΩ; TA = 0°C to +70°C by correlation with 100% electrical testing at TA=25°C
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Supply Current Outputs at
Logic 1		 VCC = 5 V 5.2 10 mA
VCC = 12 V 5.5 12
DC Input Voltage Pin 2 1.3 1.5 1.8 V
Input Threshold Voltage See (2) 55 70 85 mV
Input Discharge Current Pin 2; VIN = 2 V 6 11 16 µA
Input Clamp Charge Current Pin 2; VIN = 1 V 0.2 0.8 mA
RSET Pin Reference Voltage Pin 6;(3) 1.1 1.22 1.35 V
Composite Sync. & Vertical Outputs IOUT = 40 µA;
Logic 1		 VCC = 5 V 4.0 4.5 V
VCC = 12 V 11
IOUT = 1.6 mA
Logic 1		 VCC = 5 V 2.4 3.6 V
VCC = 12 V 10
Burst Gate and Odd and Even Outputs IOUT = 40 µA;
Logic 1		 VCC = 5 V 4 4.5 V
VCC = 12 V 11
Composite Sync. Output IOUT = −1.6 mA; Logic 0; Pin 1 0.2 0.8 V
Vertical Sync. Output IOUT = −1.6 mA; Logic 0; Pin 3 0.2 0.8 V
Burst Gate Output IOUT = −1.6 mA; Logic 0; Pin 5 0.2 0.8 V
Odd and Even Output IOUT = −1.6 mA; Logic 0; Pin 7 0.2 0.8 V
Vertical Sync Width 190 230 300 µs
Burst Gate Width 2.7 kΩ from Pin 5 to VCC 2.5 4 4.7 µs
Vertical Default Time See (4) 32 65 90 µs
(1) Typicals are at TJ = 25°C and represent the most likely parametric norm.
(2) Relative difference between the input clamp voltage and the minimum input voltage which produces a horizontal output pulse.
(3) Careful attention should be made to prevent parasitic capacitance coupling from any output pin (Pins 1, 3, 5 and 7) to the RSET pin (Pin 6).
(4) Delay time between the start of vertical sync (at input) and the vertical output pulse.

6.5 Dissipation Ratings

MIN MAX UNIT
Package Dissipation(2) 1100 mW

6.6 Typical Characteristics

LM1881 00915007.pngFigure 1. RSET Value Selection vs Vertical Serration Pulse Separation
LM1881 00915009.pngFigure 3. Burst or Black Level Gate Time vs RSET
LM1881 00915011.gifFigure 5. Vertical Pulse Width vs Temperature
LM1881 00915008.pngFigure 2. Vertical Default Sync Delay Time vs RSET
LM1881 00915010.pngFigure 4. Vertical Pulse Width vs RSET
LM1881 00915002.pngFigure 6. Supply Current vs Supply Voltage