SNVS124E November   1999  – February 2020 LM2596

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics – 3.3-V Version
    6. 7.6  Electrical Characteristics – 5-V Version
    7. 7.7  Electrical Characteristics – 12-V Version
    8. 7.8  Electrical Characteristics – Adjustable Voltage Version
    9. 7.9  Electrical Characteristics – All Output Voltage Versions
    10. 7.10 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Delayed Start-Up
      2. 8.3.2 Undervoltage Lockout
      3. 8.3.3 Inverting Regulator
      4. 8.3.4 Inverting Regulator Shutdown Methods
    4. 8.4 Device Functional Modes
      1. 8.4.1 Discontinuous Mode Operation
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor (CIN)
      2. 9.1.2 Feedforward Capacitor (CFF)
      3. 9.1.3 Output Capacitor (COUT)
      4. 9.1.4 Catch Diode
      5. 9.1.5 Inductor Selection
      6. 9.1.6 Output Voltage Ripple and Transients
      7. 9.1.7 Open-Core Inductors
    2. 9.2 Typical Applications
      1. 9.2.1 LM2596 Fixed Output Series Buck Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design with WEBENCH Tools
          2. 9.2.1.2.2 Inductor Selection (L1)
          3. 9.2.1.2.3 Output Capacitor Selection (COUT)
          4. 9.2.1.2.4 Catch Diode Selection (D1)
          5. 9.2.1.2.5 Input Capacitor (CIN)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 LM2596 Adjustable Output Series Buck Regulator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming Output Voltage
          2. 9.2.2.2.2 Inductor Selection (L1)
          3. 9.2.2.2.3 Output Capacitor Selection (COUT)
          4. 9.2.2.2.4 Feedforward Capacitor (CFF)
          5. 9.2.2.2.5 Catch Diode Selection (D1)
          6. 9.2.2.2.6 Input Capacitor (CIN)
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Custom Design with WEBENCH Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NDH|5
  • NEB|5
  • KTT|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Considerations

The LM2596 is available in two packages: a 5-pin TO-220 (T) and a 5-pin surface mount TO-263 (S).

The TO-220 package requires a heat sink under most conditions. The size of the heat sink depends on the input voltage, the output voltage, the load current and the ambient temperature. Figure 40 shows the LM2596T junction temperature rises above ambient temperature for a 3-A load and different input and output voltages. The data for these curves was taken with the LM2596T (TO-220 package) operating as a buck switching regulator in an ambient temperature of 25°C (still air). These temperature rise numbers are all approximate and there are many factors that can affect these temperatures. Higher ambient temperatures require more heat sinking.

The TO-263 surface mount package tab is designed to be soldered to the copper on a printed-circuit board (PCB). The copper and the board are the heat sink for this package and the other heat producing components, such as the catch diode and inductor. The PCB copper area that the package is soldered to must be at least 0.4 in2, and ideally must have two or more square inches of 2-oz. (0.0028 in.) copper. Additional copper area improves the thermal characteristics, but with copper areas greater than approximately 6 in2, only small improvements in heat dissipation are realized. If further thermal improvements are required, TI recommends double-sided, multilayer PCB with large copper areas and airflow.

Figure 41 shows the LM2596S (TO-263 package) junction temperature rise above ambient temperature with a 2-A load for various input and output voltages. This data was taken with the circuit operating as a buck switching regulator with all components mounted on a PCB to simulate the junction temperature under actual operating conditions. This curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware that there are many factors that can affect the junction temperature. When load currents higher than 2 A are used, double-sided or multilayer PCB with large copper areas or airflow might be required, especially for high ambient temperatures and high output voltages.

For the best thermal performance, wide copper traces and generous amounts of PCB copper must be used in the board layout. (One exception to this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further.

Package thermal resistance and junction temperature rise numbers are all approximate, and there are many factors that will affect these numbers. Some of these factors include board size, shape, thickness, position, location, and even board temperature. Other factors are trace width, total printed-circuit copper area, copper thickness, single- or double-sided multilayer board, and the amount of solder on the board. The effectiveness of the PCB to dissipate heat also depends on the size, quantity, and spacing of other components on the board, as well as whether the surrounding air is still or moving. Furthermore, some of these components such as the catch diode will add heat to the PCB and the heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core material, and the DC resistance, it can either act as a heat sink taking heat away from the board, or it could add heat to the board.

LM2596 01258334.png
CIRCUIT DATA FOR TEMPERATURE RISE CURVE TO-220 PACKAGE (T)
Capacitors Through-hole electrolytic
Inductor Through-hole, Renco
Diode Through-hole, 5-A 40-V, Schottky
PCB 3-square inch, single-sided, 2-oz. copper (0.0028″)
Figure 40. Junction Temperature Rise, TO-220
LM2596 01258335.png
CIRCUIT DATA FOR TEMPERATURE RISE CURVE TO-263 PACKAGE (S)
Capacitors Surface-mount tantalum, molded D size
Inductor Surface-mount, Pulse Engineering, 68 μH
Diode Surface-mount, 5-A 40-V, Schottky
PCB 9-square inch, single-sided, 2-oz. copper (0.0028″)
Figure 41. Junction Temperature Rise, TO-263