SNVS124E November   1999  – February 2020 LM2596

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics – 3.3-V Version
    6. 7.6  Electrical Characteristics – 5-V Version
    7. 7.7  Electrical Characteristics – 12-V Version
    8. 7.8  Electrical Characteristics – Adjustable Voltage Version
    9. 7.9  Electrical Characteristics – All Output Voltage Versions
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Delayed Start-Up
      2. 8.3.2 Undervoltage Lockout
      3. 8.3.3 Inverting Regulator
      4. 8.3.4 Inverting Regulator Shutdown Methods
    4. 8.4 Device Functional Modes
      1. 8.4.1 Discontinuous Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor (CIN)
      2. 9.1.2 Feedforward Capacitor (CFF)
      3. 9.1.3 Output Capacitor (COUT)
      4. 9.1.4 Catch Diode
      5. 9.1.5 Inductor Selection
      6. 9.1.6 Output Voltage Ripple and Transients
      7. 9.1.7 Open-Core Inductors
    2. 9.2 Typical Applications
      1. 9.2.1 LM2596 Fixed Output Series Buck Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design with WEBENCH Tools
          2. 9.2.1.2.2 Inductor Selection (L1)
          3. 9.2.1.2.3 Output Capacitor Selection (COUT)
          4. 9.2.1.2.4 Catch Diode Selection (D1)
          5. 9.2.1.2.5 Input Capacitor (CIN)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 LM2596 Adjustable Output Series Buck Regulator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming Output Voltage
          2. 9.2.2.2.2 Inductor Selection (L1)
          3. 9.2.2.2.3 Output Capacitor Selection (COUT)
          4. 9.2.2.2.4 Feedforward Capacitor (CFF)
          5. 9.2.2.2.5 Catch Diode Selection (D1)
          6. 9.2.2.2.6 Input Capacitor (CIN)
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Custom Design with WEBENCH Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NDH|5
  • NEB|5
  • KTT|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) LM2596 UNIT
KTW (TO-263) NDZ (TO-220)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance(2)(3) See(4) — 50 °C/W
See(5) 50 —
See(6) 30 —
See(7) 20 —
RθJC(top) Junction-to-case (top) thermal resistance 2 2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The package thermal impedance is calculated in accordance to JESD 51-7.
(3) Thermal Resistances were simulated on a 4-layer, JEDEC board.
(4) Junction to ambient thermal resistance (no external heat sink) for the package mounted TO-220 package mounted vertically, with the leads soldered to a printed circuit board with (1 oz.) copper area of approximately 1 in2.
(5) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 0.5 in2 of 1-oz copper area.
(6) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 2.5 in2 of 1-oz copper area.
(7) Junction to ambient thermal resistance with the TO-263 package tab soldered to a double sided printed circuit board with 3 in2 of 1-oz copper area on the LM2596S side of the board, and approximately 16 in2 of copper on the other side of the PCB.