SNVS129F May   2004  – June 2016 LM2675

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - 3.3 V
    6. 7.6  Electrical Characteristics - 5 V
    7. 7.7  Electrical Characteristics - 12 V
    8. 7.8  Electrical Characteristics - Adjustable
    9. 7.9  Electrical Characteristics - All Output Voltage Versions
    10. 7.10 Typical Characteristics
    11. 7.11 Typical Characteristics - Fixed Output Voltage Versions
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Adjustable Output Voltage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Fixed Output Voltage Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection (L1)
          2. 9.2.1.2.2 Output Capacitor Selection (COUT)
          3. 9.2.1.2.3 Catch Diode Selection (D1)
          4. 9.2.1.2.4 Input Capacitor (CIN)
          5. 9.2.1.2.5 Boost Capacitor (CB)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Adjustable Output Voltage Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming Output Voltage
          2. 9.2.2.2.2 Inductor Selection (L1)
          3. 9.2.2.2.3 Output Capacitor SeIection (COUT)
          4. 9.2.2.2.4 Catch Diode Selection (D1)
          5. 9.2.2.2.5 Input Capacitor (CIN)
          6. 9.2.2.2.6 Boost Capacitor (CB)
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 WSON Package Devices
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

D or P Package
8-Pin SOIC or PDIP
Top View
NHN Package
16-Pin WSON
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME D, P NHN
CB 1 1 I Boot-strap capacitor connection for high-side driver. Connect a high quality
470-nF capacitor from CB to VSW pin.
FB 4 8 I Feedback sense input pin. Connect to the midpoint of feedback divider to set VOUT for adjustable version or connect this pin directly to the output capacitor for a fixed output version.
GND 6 11, 12 — Power ground pins. Connect to system ground. Ground pins of CIN and COUT. Path to CIN must be as short as possible.
NC 2, 3 2, 3, 4, 5,
6, 7, 10, 13		 — No connect pins.
ON/OFF 5 9 I Enable input to the voltage regulator. High = ON and low = OFF. Pull this pin high or float to enable the regulator.
VIN 7 14 I Supply input pin to collector pin of high side FET. Connect to power supply and input bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and GND must be as short as possible.
VSW 8 15, 16 O Source pin of the internal High Side FET. This is a switching node. Attached this pin to an inductor and the cathode of the external diode.