SLOS066AC September   1975  – March 2024 LM124 , LM124A , LM224 , LM224A , LM224K , LM224KA , LM2902 , LM2902B , LM2902BA , LM2902K , LM2902KAV , LM2902KV , LM324 , LM324A , LM324B , LM324BA , LM324K , LM324KA

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - LM324B and LM324BA
    6. 5.6  Electrical Characteristics - LM2902B and LM2902BA
    7. 5.7  Electrical Characteristics for LM324, LM324K, LM224, LM224K, and LM124
    8. 5.8  Electrical Characteristics for LM2902, LM2902K, LM2902KV and LM2902KAV
    9. 5.9  Electrical Characteristics for LM324A, LM324KA, LM224A, LM224KA, and LM124A
    10. 5.10 Operating Conditions
    11. 5.11 Typical Characteristics
    12. 5.12 Typical Characteristics: All Devices Except B and BA Versions
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Unity-Gain Bandwidth
      2. 7.3.2 Slew Rate
      3. 7.3.3 Input Common Mode Range
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) LMx24, LM2902 LMx24 UNIT
D
(SOIC)		 DB
(SSOP)		 N
(PDIP)		 NS
(SO)		 PW
(TSSOP)		 RTE (WQFN)(5) FK
(LCCC)		 J
(CDIP)		 W
(CFP)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 16 PINS 20 PINS 14 PINS 14 PINS
RθJA(2)(3) Junction-to-ambient thermal resistance 86 86 80 76 113 TBD — — — °C/W
RθJC(4) Junction-to-case (top) thermal resistance — — — — — TBD 5.61 15.05 14.65 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(3) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) Maximum power dissipation is a function of TJ(max), RθJA, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) – TC)/RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(5) This package is preview only.