SNOS641I October   1999  – July 2025 LM4041-N , LM4041-N-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: ADJ Pinouts
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  LM4041-N LM4041-N-Q1 1.2 Electrical Characteristics (Industrial Temperature Range)
    6. 5.6  LM4041-N LM4041-N-Q1 1.2 Electrical Characteristics (Industrial Temperature Range)
    7. 5.7  LM4041-N LM4041-N-Q1 1.2 Electrical Characteristics (Extended Temperature Range)
    8. 5.8  LM4041-N LM4041-N-Q1 ADJ (Adjustable) Electrical Characteristics (Industrial Temperature Range)
    9. 5.9  LM4041-N LM4041-N-Q1 ADJ (Adjustable) Electrical Characteristics (Extended Temperature Range)
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Shunt Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Adjustable Shunt Regulator
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detail Design Procedure
      3. 8.2.3 Bounded Amplifier
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detail Design Procedure
        3. 8.2.3.3 Application Curve
      4. 8.2.4 Voltage Level Detector
        1. 8.2.4.1 Design Procedure
        2. 8.2.4.2 Detail Design Procedure
      5. 8.2.5 Precision Current Sink and Source
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
      6. 8.2.6 100mA Current Source
        1. 8.2.6.1 Design Requirements
        2. 8.2.6.2 Detailed Design Procedure
      7. 8.2.7 LM4041 in Clamp Circuits
        1. 8.2.7.1 Design Requirements
        2. 8.2.7.2 Detailed Design Procedure
      8. 8.2.8 Floating Current Detector
        1. 8.2.8.1 Design Requirement
        2. 8.2.8.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4 Electrostatic Discharge Caution

LM4041-N LM4041-N-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.