SNVSBB3 October   2019 LM5163

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Typical Application Efficiency, VOUT = 12 V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Control Architecture
      2. 7.3.2  Internal VCC Regulator and Bootstrap Capacitor
      3. 7.3.3  Regulation Comparator
      4. 7.3.4  Internal Soft Start
      5. 7.3.5  On-Time Generator
      6. 7.3.6  Current Limit
      7. 7.3.7  N-Channel Buck Switch and Driver
      8. 7.3.8  Synchronous Rectifier
      9. 7.3.9  Enable/Undervoltage Lockout (EN/UVLO)
      10. 7.3.10 Power Good (PGOOD)
      11. 7.3.11 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Sleep Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Switching Frequency (RRON)
        3. 8.2.2.3 Buck Inductor (LO)
        4. 8.2.2.4 Output Capacitor (COUT)
        5. 8.2.2.5 Input Capacitor (CIN)
        6. 8.2.2.6 Type 3 Ripple Network
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact PCB Layout for EMI Reduction
      2. 10.1.2 Feedback Resistors
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC LM5163  UNIT
DDA (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 43.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.5 °C/W
RθJB Junction-to-board thermal resistance 16.1 °C/W
ΨJT Junction-to-top characterization parameter 4.0 °C/W
ΨJB Junction-to-board characterization parameter 16.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.9 °C/W