SNVSBZ3 June   2021 LM5168-Q1

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Control Architecture
      2. 8.3.2  Internal VCC Regulator and Bootstrap Capacitor
      3. 8.3.3  Internal Soft Start
      4. 8.3.4  On-Time Generator
      5. 8.3.5  Current Limit
      6. 8.3.6  N-Channel Buck Switch and Driver
      7. 8.3.7  Synchronous Rectifier
      8. 8.3.8  Enable/Undervoltage Lockout (EN/UVLO)
      9. 8.3.9  Power Good (PGOOD)
      10. 8.3.10 Thermal Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 Sleep Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Switching Frequency (RT)
        2. 9.2.2.2  Transformer Selection
        3. 9.2.2.3  Output Capacitor Selection
        4. 9.2.2.4  Secondary Output Diode
        5. 9.2.2.5  Regulation Comparator
        6. 9.2.2.6  Input Capacitor
        7. 9.2.2.7  Type-3 Ripple Network
        8. 9.2.2.8  Minimum Secondary Output Load
        9. 9.2.2.9  Example Design Summary
        10. 9.2.2.10 Thermal Considerations
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Compact PCB Layout for EMI Reduction
      2. 11.1.2 Feedback Resistors
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Protection

The LM516x-Q1 includes an internal junction temperature monitor to protect the device in the event of a higher than normal junction temperature. If the junction temperature exceeds 175°C (typical), thermal shutdown occurs to prevent further power dissipation and temperature rise. The LM516x-Q1 initiates a restart sequence when the junction temperature falls to 165°C, based on a typical thermal shutdown hysteresis of 10°C. This is a non-latching protection, so the device cycles into and out of thermal shutdown if the fault persists.