SNVSB55G February   2019  – September 2022 LM63615-Q1 , LM63625-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1.     Absolute Maximum Ratings
    2. 7.1 ESD Ratings
    3. 7.2 Recommended Operating Conditions
    4. 7.3 Thermal Information
    5. 7.4 Electrical Characteristics
    6. 7.5 Timing Characteristics
    7. 7.6 Switching Characteristics
    8. 7.7 System Characteristics
    9. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sync/Mode Selection
      2. 8.3.2 Output Voltage Selection
      3. 8.3.3 Switching Frequency Selection
        1. 8.3.3.1 Spread Spectrum Option
      4. 8.3.4 Enable and Start-up
      5. 8.3.5 RESET Flag Output
      6. 8.3.6 Undervoltage Lockout and Thermal Shutdown and Output Discharge
    4. 8.4 Device Functional Modes
      1. 8.4.1 Overview
      2. 8.4.2 Light Load Operation
        1. 8.4.2.1 Sync/FPWM Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Minimum On-time Operation
      5. 8.4.5 Current Limit and Short-Circuit Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Choosing the Switching Frequency
        2. 9.2.2.2 Setting the Output Voltage
          1. 9.2.2.2.1 CFF Selection
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Input Capacitor Selection
        6. 9.2.2.6 CBOOT
        7. 9.2.2.7 VCC
        8. 9.2.2.8 External UVLO
        9. 9.2.2.9 Maximum Ambient Temperature
      3. 9.2.3 Full Feature Design Example
      4. 9.2.4 Application Curves
      5. 9.2.5 EMI Performance Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Glossary
    7. 12.7 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 System Characteristics

The following specifications apply only to the typical applications circuit with nominal component values. Specifications in the typical (TYP) column apply to TJ = 25°C only. Specifications in the minimum (MIN) and maximum (MAX) columns apply to the case of typical components over the temperature range of TJ = –40°C to 150°C. These specifications are not ensured by production testing.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE (VIN PIN)
ISUPPLY Input supply current when in regulation VIN = 12 V, VOUT = 3.3 V, IOUT = 0 A, RFBT = 1 MΩ 23 µA
VDROP Dropout voltage; (VIN – VOUT) VOUT = 5 V, IOUT = 1 A, fSW = 1850 kHz 0.95 V
VDROP Dropout voltage; (VIN – VOUT) VOUT = 5 V, IOUT = 1 A, VOUT – 1% of regulation, fSW = 140 kHz 150 mV
DMAX Maximum switch duty cycle (2) VIN = VOUT = 12 V, IOUT = 1 A 98% %
VOLTAGE REFERENCE (FB PIN)
VOUT (1) VOUT = 5 V VIN = 7 V to 30 V, IOUT = 1 A to full load, CCM –1.5% 1.5%
VOUT = 5 V VIN = 7 V to 30 V,  IOUT = 0 A to full load, auto mode –1.5% 2.5%
VOUT (1) VOUT = 3.3 V VIN = 3.8 V to 30 V, IOUT = 1 A to full load, CCM –1.5% 1.5%
VOUT = 3.3 V VIN = 3.8 V to 30 V, IOUT = 0 A to full load, auto mode –1.5% 2.5%
tSYNC-L Delay from sync clock staying low to PFM entry 100 ns
tSYNC-H Delay from sync clock staying high to default frequency 100 ns
THERMAL SHUTDOWN
TSD Thermal shutdown temperature Shutdown temperature 155 163 175 °C
TSDR Thermal shutdown temperature Recovery temperature 150 °C
(1) Deviation is with respect to VIN = 13.5 V, IOUT = 1 A.
(2) In dropout, the switching frequency drops to increase the effective duty cycle. The lowest frequency is clamped at approximately: fMIN = 1 / (tON-MAX + tOFF-MIN). DMAX = tON-MAX / (tON-MAX + tOFF-MIN).