SNVSCF0 October   2024 LM65680-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1  Output Voltage Selection
      2. 7.3.2  EN Pin and Use as VIN UVLO
      3. 7.3.3  Device Configuration
      4. 7.3.4  Single-Output Dual-Phase Operation
      5. 7.3.5  Mode Selection
        1. 7.3.5.1 MODE/SYNC Pin Uses for Synchronization
        2. 7.3.5.2 Clock Locking
      6. 7.3.6  Adjustable Switching Frequency
      7. 7.3.7  Dual Random Spread Spectrum (DRSS)
      8. 7.3.8  Internal LDO, VCC UVLO, and BIAS Input
      9. 7.3.9  Bootstrap Voltage (BST Pin)
      10. 7.3.10 Soft Start and Recovery From Dropout
      11. 7.3.11 Safety Features
        1. 7.3.11.1 Power-Good Monitor
        2. 7.3.11.2 Overcurrent and Short-Circuit Protection
        3. 7.3.11.3 Hiccup
        4. 7.3.11.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Peak Current Mode Operation
        2. 7.4.2.2 Auto Mode Operation
          1. 7.4.2.2.1 Diode Emulation
        3. 7.4.2.3 FPWM Mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Train Components
        1. 8.1.1.1 Buck Inductor
        2. 8.1.1.2 Output Capacitors
        3. 8.1.1.3 Input Capacitors
        4. 8.1.1.4 EMI Filter
      2. 8.1.2 Error Amplifier and Compensation
      3. 8.1.3 Maximum Ambient Temperature
        1. 8.1.3.1 Derating Curves
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Output Capacitors
        3. 8.2.2.3 Feed-forward Capacitor (CFF)
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Choosing the Switching Frequency
        6. 8.2.2.6 Setting the Output Voltage
        7. 8.2.2.7 Compensation Components
        8. 8.2.2.8 CBST
        9. 8.2.2.9 External UVLO
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
        1. 9.2.1.1 PCB Layout Resources
        2. 9.2.1.2 Thermal Design Resources
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.3 Device Configuration

The device configuration is implemented with the CONFIG pin.

The CONFIG pin configures the device as a primary or a secondary device, selects either internal compensation (1-phase operation) or external compensation (1-phase or 2-phase operation), and affects the DRSS / MODECOMM pin functionality as shown in the following table.

Table 7-2 Device Configuration
CONFIG Pin Configuration DRSS / MODECOMM Pin Functionality
Short to GND Secondary device, CLKOUT disabled MODECOMM input
49.9kΩ to GND Primary device, external COMP, CLKOUT enabled DRSS control, MODECOMM output
Short to VCC Primary device, internal COMP, CLKOUT disabled DRSS control