SNOS760C May   1999  – September 2014 LM7171

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 ±15V DC Electrical Characteristics
    6. 6.6 ±15V AC Electrical Characteristics
    7. 6.7 ±5V DC Electrical Characteristics
    8. 6.8 ±5V AC Electrical Characteristics
    9. 6.9 Typical Performance Characteristics
  7. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Circuit Operation
    3. 7.3 Slew Rate Characteristic
    4. 7.4 Slew Rate Limitation
    5. 7.5 Compensation For Input Capacitance
    6. 7.6 Application Circuit
  8. Power Supply Recommendations
    1. 8.1 Power Supply Bypassing
    2. 8.2 Termination
    3. 8.3 Driving Capacitive Loads
    4. 8.4 Power Dissipation
  9. Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Printed Circuit Board and High Speed Op Amps
      2. 9.1.2 Using Probes
      3. 9.1.3 Component Selection and Feedback Resistor
  10. 10Device and Documentation Support
    1. 10.1 Trademarks
    2. 10.2 Electrostatic Discharge Caution
    3. 10.3 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Trademarks

VIP is a trademark of TI.

All other trademarks are the property of their respective owners.

10.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

10.3 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.