SNOS469J April 2000 – January 2015 LM8261
For related documentation, see IC Package Thermal Metrics Application Report, SPRA953
All other trademarks are the property of their respective owners.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.