SNOS611F July   1999  – March 2025 LMC6041 , LMC6042 , LMC6044

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: LMC6041
    5. 5.5 Thermal Information: LMC6042
    6. 5.6 Thermal Information: LMC6044
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Amplifier Topology
      2. 6.1.2 Compensating For Input Capacitance
      3. 6.1.3 Capacitive-Load Tolerance
    2. 6.2 Typical Applications
      1. 6.2.1 Instrumentation Amplifiers
      2. 6.2.2 Low-Leakage Sample and Hold
      3. 6.2.3 Square-Wave Generator
      4. 6.2.4 AC Coupled Power Amplifier
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed-Circuit-Board Layout for High-Impedance Work
      2. 6.3.2 Layout Examples
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3.     Trademarks
    4. 7.3 Electrostatic Discharge Caution
    5. 7.4 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Differential input voltage ±Supply voltage
VS Supply voltage, VS = (V+) – (V–) 16 V
ISC Output short circuit(5) To V+ See(3)
To V– See(4)
Voltage at input/output pin (V–) – 0.3 (V+) + 0.3 V
Current at input pin ±5 mA
Current at output pin ±18
Current at power supply pin 35
PD Power dissipation See(5)
Lead temperature (soldering, 10s) 260 °C
TJ Junction temperature(5) 110 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Do not connect output to V+ when V+ is greater than 13V or reliability can be adversely affected.
(4) Applies to both single-supply operation. Continuous short-circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 110°C. Output currents in excess of ±30mA over the long term can adversely affect reliability.
(5) The maximum power dissipation is a function of TJ(Max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(Max) − TA) / θJA.