SNOS674G November   1997  – April 2020 LMC6482

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Rail-to-Rail Input
      2.      Rail-to-Rail Output
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for V+ = 5 V
    6. 6.6 Electrical Characteristics for V+ = 3 V
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Amplifier Topology
      2. 7.3.2 Input Common-Mode Voltage Range
      3. 7.3.3 Rail-to-Rail Output
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Upgrading Applications
      2. 8.1.2 Data Acquisition Systems
      3. 8.1.3 Instrumentation Circuits
      4. 8.1.4 Spice Macromodel
    2. 8.2 Typical Applications
      1. 8.2.1 3-V Single-Supply Buffer Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitive Load Compensation
          2. 8.2.1.2.2 Capacitive Load Tolerance
          3. 8.2.1.2.3 Compensating For Input Capacitance
          4. 8.2.1.2.4 Offset Voltage Adjustment
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Single-Supply Applications
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Differential input voltage ±Supply Voltage
Voltage at input/output pin (V) – 0.3 (V+) + 0.3 V
Supply voltage (V+ − V) 16 V
Current at input pin (3) −5 5 mA
Current at output pin(4)(5) –30 30 mA
Current at power supply pin 40 mA
Lead temperature (soldering, 10 sec.) 260 °C
Junction temperature (6) 150 °C
Tstg Storage temperature –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely affect reliability.
Do not short circuit output to V+, when V+ is greater than 13 V or reliability will be adversely affected.
The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) − TA)/θJA. All numbers apply for packages soldered directly into a PC board.