SNOSD12D November 2018 – January 2019 LMG1210
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- RVR|19
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.7 Typical Characteristics
Figure 1. Peak Source Current vs Output Voltage 
Figure 3. IDD vs Frequency, Unloaded 
Figure 5. IDD vs Temperature 
Figure 7. Propagation Delay vs Temperature 
Figure 9. Propagation Delay Change vs Bootstrap voltage 
Figure 11. LO and HO Output Current vs Temperature 
Figure 2. Peak Sink Current vs Output Voltage 
Figure 4. IHBO vs Frequency, Unloaded 
Figure 6. IHB vs Temperature 
Figure 8. Minimum Dead Time vs Temperature 
Figure 10. Propagation Delay vs relative phase of CMTI Phase 
Figure 12. 1 nF Loaded Rise and Fall Time vs Temperature