SNAS722A December 2017 – October 2018 LMK61E07
The LMK61E07 is a high performance device. Therefore pay careful attention to device configuration and printed-circuit board (PCB) layout with respect to power consumption. The ground pin needs to be connected to the ground plane of the PCB through three vias or more, as shown in Figure 36, to maximize thermal dissipation out of the package.
Equation 4 describes the relationship between the PCB temperature around the LMK61E07 and its junction temperature.
To ensure that the maximum junction temperature of LMK61E07 is below 115°C, it can be calculated that the maximum PCB temperature without airflow should be at 90°C or below when the device is optimized for best performance resulting in maximum on-chip power dissipation of 0.69 W.