SNAS826 April   2022 LMK6C

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 LMK6P/D Thermal Information
    5. 7.5 LMK6C Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Timing Diagrams
  8. Parameter Measurement Information
    1. 8.1 Device Output Configurations
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bulk Acoustic Wave (BAW)
      2. 9.3.2 Device Block-Level Description
      3. 9.3.3 Function Pin(s)
      4. 9.3.4 Clock Output Interfacing and Termination
      5. 9.3.5 Temperature Stability
      6. 9.3.6 Mechanical Robustness
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Ensuring Thermal Reliability
      2. 12.1.2 Best Practices for Signal Integrity
      3. 12.1.3 Recommended Solder Reflow Profile
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Device Nomenclature
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Packaging Information
    2. 14.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DLF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Ensuring Thermal Reliability

The LMK6x is a high-performance device. Therefore, pay careful attention to device configuration and printed circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground plane of the PCB through three vias or more, as shown in Figure 12-1, to maximize thermal dissipation out of the package.

The equation below describes the relationship between the PCB temperature around the LMK6x and its junction temperature.

Equation 1. TB = TJ – ΨJB × P

where

  • TB: PCB temperature around the LMK6x
  • TJ: Junction temperature of LMK6x
  • ΨJB: Junction-to-board thermal resistance parameter of LMK6x (refer to the Thermal Information tables in the Section 7 section for this information)
  • P: On-chip power dissipation of LMK6x