SNAS826 April 2022 LMK6C
The LMK6x is a high-performance device. Therefore, pay careful attention to device configuration and printed circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground plane of the PCB through three vias or more, as shown in Figure 12-1, to maximize thermal dissipation out of the package.
The equation below describes the relationship between the PCB temperature around the LMK6x and its junction temperature.