SNVS730C October   2011  – June 2019 LMR10520

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft-Start
      2. 7.3.2 Output Overvoltage Protection
      3. 7.3.3 Undervoltage Lockout
      4. 7.3.4 Current Limit
      5. 7.3.5 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Inductor Selection
        3. 8.2.1.3 Input Capacitor
        4. 8.2.1.4 Output Capacitor
        5. 8.2.1.5 Catch Diode
        6. 8.2.1.6 Output Voltage
        7. 8.2.1.7 Calculating Efficiency and Junction Temperature
      2. 8.2.2 Application Curves
      3. 8.2.3 Other System Examples
        1. 8.2.3.1 LMR10520X Design Example 1
        2. 8.2.3.2 LMR10510X Design Example 2
        3. 8.2.3.3 LMR10510Y Design Example 3
        4. 8.2.3.4 LMR10510Y Design Example 4
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Definitions
    4. 9.4 WSON Package
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Electrical Characteristics

VIN = 5 V unless otherwise indicated under the TEST CONDITIONS column. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of –40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.(3)(4)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback Voltage 0.588 0.600 0.612 V
ΔVFB/VIN Feedback Voltage Line Regulation VIN = 3V to 5V 0.02 %/V
IB Feedback Input Bias Current 0.1 100 nA
UVLO Undervoltage Lockout VIN Rising 2.73 2.90 V
VIN Falling 1.85 2.3
UVLO Hysteresis 0.43 V
FSW Switching Frequency LMR10520-X 1.2 1.6 1.95 MHz
LMR10520-Y 2.25 3.0 3.75
DMAX Maximum Duty Cycle LMR10520-X 86% 94%
LMR10520-Y 82% 90%
DMIN Minimum Duty Cycle LMR10520-X 5%
LMR10520-Y 7%
RDS(ON) Switch On Resistance 150 mΩ
ICL Switch Current Limit VIN = 3.3V 2.4 3.25 A
VEN_TH Shutdown Threshold Voltage 0.4 V
Enable Threshold Voltage 1.8
ISW Switch Leakage 100 nA
IEN Enable Pin Current Sink/Source 100 nA
IQ Quiescent Current (switching) LMR10520X VFB = 0.55 3.3 5 mA
LMR10520Y VFB = 0.55 4.3 6.5
Quiescent Current (shutdown) All Options VEN = 0V 30 nA
θJA Junction to Ambient
0 LFPM Air Flow(5) 		80 °C/W
θJC Junction to Case 18 °C/W
TSD Thermal Shutdown Temperature 165 °C
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Range indicates conditions for which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and test conditions, see Electrical Characteristics.
(2) Thermal shutdown occurs if the junction temperature exceeds the maximum junction temperature of the device.
(3) Minimum and Maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(4) Typical numbers are at 25°C and represent the most likely parametric norm.
(5) Applies for packages soldered directly onto a 3” × 3” PC board with 2 oz. copper on 4 layers in still air.
(6) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.