SNVSAH4C December   2015  – February 2018 LMR23610

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Load VIN = 12 V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed Frequency Peak Current Mode Control
      2. 7.3.2 Adjustable Output Voltage
      3. 7.3.3 EN/SYNC
      4. 7.3.4 VCC, UVLO
      5. 7.3.5 Minimum ON-Time, Minimum OFF-Time and Frequency Foldback at Dropout Conditions
      6. 7.3.6 Internal Compensation and CFF
      7. 7.3.7 Bootstrap Voltage (BOOT)
      8. 7.3.8 Overcurrent and Short-Circuit Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Mode
      4. 7.4.4 Light Load Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Output Voltage Setpoint
        3. 8.2.2.3  Switching Frequency
        4. 8.2.2.4  Inductor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  Feed-Forward Capacitor
        7. 8.2.2.7  Input Capacitor Selection
        8. 8.2.2.8  Bootstrap Capacitor Selection
        9. 8.2.2.9  VCC Capacitor Selection
        10. 8.2.2.10 Undervoltage Lockout Setpoint
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout for EMI Reduction
      2. 10.1.2 Ground Plane and Thermal Considerations
      3. 10.1.3 Feedback Resistors
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Limits apply over the recommended operating junction temperature (TJ) range of –40°C to +125°C, unless otherwise stated. Minimum and Maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
POWER SUPPLY (VIN PIN)
VIN Operation input voltage 4 36 V
VIN_UVLO Undervoltage lockout thresholds Rising thresholdi 3.3 3.7 3.9 V
Falling threshold 2.9 3.3 3.5
ISHDN Shutdown supply current VEN = 0 V, VIN =12 V, TJ = –40°C to 125°C 2 4 μA
IQ Operating quiescent current (non-switching) VIN =12 V, VFB = 1.1 V, TJ = –40°C to 125°C, PFM mode 75 μA
ENABLE (EN/SYNC PIN)
VEN_H Enable rising threshold voltage 1.4 1.55 1.7 V
VEN_HYS Enable hysteresis voltage 0.4 V
VWAKE Wake-up threshold 0.4 V
IEN Input leakage current at EN pin VIN = 4 V to 36 V, VEN = 2 V 10 100 nA
VIN = 4 V to 36 V, VEN= 36 V 1 μA
VOLTAGE REFERENCE (FB PIN)
VREF Reference voltage VIN = 4 V to 36 V, TJ = 25°C 0.985 1 1.015 V
VIN = 4 V to 36 V, TJ = –40°C to 125°C 0.98 1 1.02
ILKG_FB Input leakage current at FB pin VFB = 1 V 10 nA
INTERNAL LDO (VCC PIN)
VCC Internal LDO output voltage 4.1 V
VCC_UVLO VCC undervoltage lockout thresholds Rising threshold 2.8 3.2 3.6 V
Falling threshold 2.4 2.8 3.2
CURRENT LIMIT
IHS_LIMIT Peak inductor current limit 1.4 2 2.6 A
ILS_LIMIT Valley inductor current limit 1 1.5 2.1 A
IL_ZC Zero cross-current limit –0.04 A
INTEGRATED MOSFETS
RDS_ON_HS High-side MOSFET ON-resistance VIN = 12 V, IOUT = 1 A 185 mΩ
RDS_ON_LS Low-side MOSFET ON-resistance VIN = 12 V, IOUT = 1 A 105 mΩ
THERMAL SHUTDOWN
TSHDN Thermal shutdown threshold 162 170 178 °C
THYS Hysteresis 15 °C