SNVSAH2E December   2015  – August 2020 LMR23630

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency Peak Current Mode Control
      2. 8.3.2  Adjustable Frequency
      3. 8.3.3  Adjustable Output Voltage
      4. 8.3.4  Enable/Sync
      5. 8.3.5  VCC, UVLO
      6. 8.3.6  Minimum ON-time, Minimum OFF-time and Frequency Foldback at Dropout Conditions
      7. 8.3.7  Power Good (PGOOD)
      8. 8.3.8  Internal Compensation and CFF
      9. 8.3.9  Bootstrap Voltage (BOOT)
      10. 8.3.10 Overcurrent and Short-Circuit Protection
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 CCM Mode
      4. 8.4.4 Light Load Operation (PFM Version)
      5. 8.4.5 Light Load Operation (FPWM Version)
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Output Voltage Setpoint
        3. 9.2.2.3  Switching Frequency
        4. 9.2.2.4  Inductor Selection
        5. 9.2.2.5  Output Capacitor Selection
        6. 9.2.2.6  Feed-Forward Capacitor
        7. 9.2.2.7  Input Capacitor Selection
        8. 9.2.2.8  Bootstrap Capacitor Selection
        9. 9.2.2.9  VCC Capacitor Selection
        10. 9.2.2.10 Undervoltage Lockout Setpoint
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Compact Layout for EMI Reduction
    4. 11.4 Ground Plane and Thermal Considerations
    5. 11.5 Feedback Resistors
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Custom Design With WEBENCH® Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
  • DRR|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

Limits apply over the recommended operating junction temperature (TJ) range of –40°C to +125°C, unless otherwise stated. Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25 °C, and are provided for reference purposes only.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
POWER SUPPLY (VIN PIN)
VINOperation input voltage436V
VIN_UVLOUndervoltage lockout thresholdsRising threshold3.33.73.9V
Falling threshold2.93.33.5
ISHDNShutdown supply current24μA
VEN = 0 V, VIN = 12 V, TJ = –40°C to 125°C
IQOperating quiescent current (non- switching)VIN =12 V, VFB = 1.1 V, TJ = –40°C to 125°C, PFM mode75μA
ENABLE (EN/SYNC PIN)
VEN_HEnable rising threshold voltage1.41.551.7V
VEN_HYSEnable hysteresis voltage0.4V
VWAKEWake-up threshold0.4V
IENInput leakage current at EN pinVIN = 4 V to 36 V, VEN= 2 V10100nA
nA
VIN = 4 V to 36 V, VEN= 36 V1μA
μA
VOLTAGE REFERENCE (FB PIN)
VREFReference voltageVIN = 4.0 V to 36 V, TJ = 25 °C0.98511.015V
VIN = 4.0 V to 36 V, TJ = –40°C to 125°C0.9811.02V
ILKG_FBInput leakage current at FB pinVFB= 1 V10nA
POWER GOOD (PGOOD PIN)
VPG_OVPower-good flag overvoltage tripping threshold% of reference voltage104%107%110%
VPG_UVPower-good flag undervoltage tripping threshold% of reference voltage92%94%96.5%
VPG_HYSPower-good flag recovery hysteresis% of reference voltage1.5%
VIN_PG_MINMinimum VIN for valid PGOOD output50 μA pullup to PGOOD pin, VEN = 0 V, TJ = 25°C1.5V
VPG_LOWPGOOD low level output voltage50 μA pullup to PGOOD pin, VIN = 1.5 V, VEN = 0 V0.4V
0.5 mA pullup to PGOOD pin, VIN = 13.5 V, VEN = 0 V0.4V
INTERNAL LDO (VCC PIN)
VCCInternal LDO output voltage4.1V
VCC_UVLOVCC undervoltage lockout thresholdsRising threshold2.83.23.6V
Falling threshold2.42.83.2
CURRENT LIMIT
IHS_LIMITPeak inductor current limitHSOIC package3.856.2A
WSON package45.56.6
ILS_LIMITValley inductor current limitHSOIC package2.93.64.6A
WSON package2.93.64.2
IL_ZCZero cross current limitHSOIC and WSON package–0.04A
IL_NEGNegative current limit (FPWM option)SOIC and WSON package–2.7–2–1.3A
INTEGRATED MOSFETS
RDS_ON_HSHigh-side MOSFET ON-resistanceSOIC package, VIN = 12 V, IOUT = 1 A185mΩ
WSON package, VIN = 12 V, IOUT = 1 A160
RDS_ON_LSLow-side MOSFET ON-resistanceSOIC package, VIN = 12 V, IOUT = 1 A105mΩ
WSON package, VIN = 12 V, IOUT = 1 A95
THERMAL SHUTDOWN
TSHDNThermal shutdown threshold162170178°C
THYSHysteresis15°C