SLCS136U August   1999  – October 2020 LMV331 , LMV339 , LMV393

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, VCC+ = 2.7 V
    6. 6.6 Electrical Characteristics, VCC+ = 5 V
    7. 6.7 Switching Characteristics, VCC+ = 2.7 V
    8. 6.8 Switching Characteristics, VCC+ = 5 V
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Comparison
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Range
        2. 8.2.2.2 Minimum Overdrive Voltage
        3. 8.2.2.3 Output and Drive Current
        4. 8.2.2.4 Response Time
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • PW|8
  • DDU|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)LMV339LMV393LMV331UNIT
DPWRUCDDDUDGKPWDBVDCK
14 PINS8 PINS5 PINS
RθJAJunction-to-ambient thermal resistance8611321697210172149206252°C/W
RθJC(top)Junction-to-case (top) thermal resistance——51.3——————
RθJBJunction-to-board thermal resistance——59.0——————
ψJTJunction-to-top characterization parameter——1.2——————
ψJBJunction-to-board characterization parameter——59.0——————
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.