SNAS800 July   2021 LMX1204

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Range of Dividers and Multiplier
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power On Reset
      2. 7.3.2 Clock Outputs
        1. 7.3.2.1 Clock Output Buffers
        2. 7.3.2.2 Clock MUX
        3. 7.3.2.3 Clock Divider
        4. 7.3.2.4 Clock Multiplier
      3. 7.3.3 SYSREF
        1. 7.3.3.1 SYSREF Output Buffers
          1. 7.3.3.1.1 SYSREF Output Buffer for Main Clocks
          2. 7.3.3.1.2 SYSREF Output Buffer for LOGICLK
        2. 7.3.3.2 SYSREF Frequency and Delay Generation
        3. 7.3.3.3 SYSREFREQ pins
          1. 7.3.3.3.1 SYSREFREQ Pins Common Mode Voltage
          2. 7.3.3.3.2 SYSREFREQ Pin Windowing Feature
        4. 7.3.3.4 SYNC Feature
      4. 7.3.4 LOGICLK Output
        1. 7.3.4.1 LOGICLK Output Format
        2. 7.3.4.2 LOGICLK_DIV_PRE and LOGICLK_DIV Dividers
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Applications Information
      1. 8.1.1 Current Consumption
      2. 8.1.2 Treatment of Unused Pins
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
    2. 12.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Supply Recommendations

This devices uses a 2.5-V supply for the whole device. This device does not have internal LDOs, so it is important that this device is connected to a low noise supply that does not have excessive spurious noise. A direct connection to a switching power supply will likely result in unwanted spurs at the output. Bypassing can be done individually at all the power pins, and TI recommends to have a capacitor suitable for higher frequency on the top layer so higher-value capacitors more suitable for lower frequencies can be farther away. The supply pins for the clocks and the LOGICLK should be isolated with a small resistor or ferrite bead if both are being used simultaneously. See the Section 5 section for additional recommendations for each pin.