SNAS800 July   2021 LMX1204

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Range of Dividers and Multiplier
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power On Reset
      2. 7.3.2 Clock Outputs
        1. 7.3.2.1 Clock Output Buffers
        2. 7.3.2.2 Clock MUX
        3. 7.3.2.3 Clock Divider
        4. 7.3.2.4 Clock Multiplier
      3. 7.3.3 SYSREF
        1. 7.3.3.1 SYSREF Output Buffers
          1. 7.3.3.1.1 SYSREF Output Buffer for Main Clocks
          2. 7.3.3.1.2 SYSREF Output Buffer for LOGICLK
        2. 7.3.3.2 SYSREF Frequency and Delay Generation
        3. 7.3.3.3 SYSREFREQ pins
          1. 7.3.3.3.1 SYSREFREQ Pins Common Mode Voltage
          2. 7.3.3.3.2 SYSREFREQ Pin Windowing Feature
        4. 7.3.3.4 SYNC Feature
      4. 7.3.4 LOGICLK Output
        1. 7.3.4.1 LOGICLK Output Format
        2. 7.3.4.2 LOGICLK_DIV_PRE and LOGICLK_DIV Dividers
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Applications Information
      1. 8.1.1 Current Consumption
      2. 8.1.2 Treatment of Unused Pins
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
    2. 12.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD Power supply voltage –0.3 2.75 V
VIN DC Input Voltage (SCK, SDI, CSB) GND 3.6 V
VIN DC Input Voltage (SYSREFREQ) GND VDD + 0.3 V
VIN AC Input Voltage (CLKIN) VDD Vpp
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.