SNVS641L January   2010  – April 2019 LMZ10503

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
      2.      Efficiency VOUT = 3.3 V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Enable and UVLO
      3. 7.3.3 Soft-Start
      4. 7.3.4 Soft-Start Capacitor
      5. 7.3.5 Tracking
      6. 7.3.6 Tracking - Equal Soft-Start Time
      7. 7.3.7 Tracking - Equal Slew Rates
      8. 7.3.8 Current Limit
      9. 7.3.9 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Prebias Start-Up Capability
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Output Capacitor Selection
          1. 8.2.2.3.1 Output Voltage Setting
        4. 8.2.2.4 Loop Compensation
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Application Schematic for 3.3-V to 5-V Input and 2.5-V Output With Optimized Ripple and Transient Response
      2. 8.3.2 Application Schematic for 3.3-V to 5-V Input and 2.5-V Output
      3. 8.3.3 EMI Tested Schematic for 2.5-V Output Based on 3.3-V to 5-V Input
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Estimate Power Dissipation and Thermal Considerations
    4. 10.4 Power Module SMT Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Estimate Power Dissipation and Thermal Considerations

Use the current derating curves in the Typical Characteristics section to obtain an estimate of power loss (PIC_LOSS). For the design case of VIN = 5 V, VOUT = 2.5 V, IOUT = 3 A, TA(MAX) = 85°C , and TJ(MAX) = 125°C, the device must see a thermal resistance from case to ambient (θCA) of less than:

Equation 21. LMZ10503 eq_23_SNVS610.gif
Equation 22. LMZ10503 eq_8_SNVS668.gif

Given the typical thermal resistance from junction to case (θJC) to be 1.9°C/W (typical). Continuously operating at a TJ greater than 125°C will have a shorten life span.

To reach θCA = 69.5°C/W, the PCB is required to dissipate heat effectively. With no airflow and no external heat, a good estimate of the required board area covered by 1-oz. copper on both the top and bottom metal layers is:

Equation 23. LMZ10503 eq_22_SNVS610.gif
Equation 24. LMZ10503 eq_9_SNVS668.gif

As a result, approximately 7.2 square cm of 1-oz. copper on top and bottom layers is required for the PCB design.