SNVS667I February   2010  – March 2022 LMZ12010

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Overvoltage Protection
      2. 7.3.2 Current Limit
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Prebiased Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Enable Divider, RENT, RENB, and RENH Selection
        2. 8.2.2.2 Output Voltage Selection
        3. 8.2.2.3 Soft-Start Capacitor Selection
        4. 8.2.2.4 Tracking Supply Divider Option
        5. 8.2.2.5 COUT Selection
        6. 8.2.2.6 CIN Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Power Dissipation and Thermal Considerations
    4. 10.4 Power Module SMT Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4 Power Module SMT Guidelines

The recommendations below are for a standard module surface mount assembly

  • Land Pattern — Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads.
  • Stencil Aperture
    • For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land pattern.
    • For all other I/O pads, use a 1:1 ratio between the aperture and the land pattern recommendation.
  • Solder Paste — Use a standard SAC Alloy such as SAC 305, type 3 or higher.
  • Stencil Thickness — 0.125 to 0.15 mm
  • Reflow — Refer to solder paste supplier recommendation and optimized per board size and density.
  • Refer to the Design Summary LMZ1xxx and LMZ2xxx Power Modules Family application report for reflow information.
  • Maximum number of reflows allowed is one.
GUID-990896A8-8054-4250-A42B-E5A1D4F23219-low.pngFigure 10-5 Sample Reflow Profile
Table 10-1 Sample Reflow Profile Table
ProbeMax Temp (°C)Reached Max TempTime Above 235°CReached 235°CTime Above 245°CReached 245°CTime Above 260°CReached 260°C
1242.56.580.496.390.00—0.00—
2242.57.100.556.310.007.100.00—
3241.07.090.426.440.00—0.00—