SNVS874E August   2012  – September 2021 LMZ20501

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Nano Scale Package
      2. 7.3.2 Internal Synchronous Rectifier
      3. 7.3.3 Current Limit Protection
      4. 7.3.4 Start-Up
      5. 7.3.5 Dropout Behavior
      6. 7.3.6 Power Good Flag Function
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 PFM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Setting The Output Voltage
        3. 8.2.1.3 Output and Feedforward Capacitors
        4. 8.2.1.4 Input Capacitors
        5. 8.2.1.5 Maximum Ambient Temperature
        6. 8.2.1.6 Options
      2. 8.2.2 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Soldering Information
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.1 Soldering Information

Proper operation of the LMZ20501 requires that it be correctly soldered to the PCB. This is especially true regarding the EP. This pad acts as a quiet ground reference for the device and a heatsink connection. Use the following recommendations when utilizing machine placement of the device:

  • Dimension of area for pickup: 2 mm × 2.5 mm
  • Use a nozzle size of less than 1.3 mm in diameter, so that the head does not touch the outer area of the package.
  • Use a soft tip pick-and-place head.
  • Add 0.05 mm to the component thickness so that the device will be released 0.05 mm into the solder paste without putting pressure or splashing the solder paste.
  • Slow the pick arm when picking the part from the tape and reel carrier and when depositing the device on the board.
  • If the machine releases the component by force, use the minimum force and no more than 3 N.
  • For PCBs with surface mount components on both sides, it is suggested to put the LMZ20501 on the top side. In case the application requires bottom side placement, a re-flow fixture can be required to protect the module during the second reflow.

In addition, please follow the important guidelines found in the AN-1187 Leadless Leadframe Package (LLP) Application Report. The curves in Figure 10-3 and Figure 10-4 show typical soldering temperature profiles.

GUID-7B2DE79D-65D8-4A30-8F95-5B0467CDE6AF-low.pngFigure 10-3 Typical Re-flow Profile Eutectic (63sn/37pb) Solder Paste
GUID-E73CDBD4-756E-4E8C-9782-A0B2E12AFBE3-low.pngFigure 10-4 Typical Re-flow Profile Lead-Free (Sca305 Or Sac405) Solder Paste