SLVSBV8E June   2013  – February 2020 LMZ31704

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Application
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Package Specifications
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
  6. 6 Device Information
    1. 6.1 Functional Block Diagram
    2.     Pin Functions
  7. 7 Typical Characteristics (PVIN = VIN = 12 V)
  8. 8 Typical Characteristics (PVIN = VIN = 5 V)
  9. 9 Typical Characteristics (PVIN = 3.3 V, VIN = 5 V)
  10. 10Application Information
    1. 10.1  Adjusting the Output Voltage
    2. 10.2  Capacitor Recommendations for the LMZ31704 Power Supply
      1. 10.2.1 Capacitor Technologies
        1. 10.2.1.1 Electrolytic, Polymer-Electrolytic Capacitors
        2. 10.2.1.2 Ceramic Capacitors
        3. 10.2.1.3 Tantalum, Polymer-Tantalum Capacitors
      2. 10.2.2 Input Capacitor
      3. 10.2.3 Output Capacitor
    3. 10.3  Transient Response
    4. 10.4  Transient Waveforms
    5. 10.5  Application Schematics
    6. 10.6  Custom Design With WEBENCH® Tools
    7. 10.7  VIN and PVIN Input Voltage
    8. 10.8  3.3 V PVIN Operation
    9. 10.9  Power Good (PWRGD)
    10. 10.10 SYNC_OUT
    11. 10.11 Parallel Operation
    12. 10.12 Light Load Efficiency (LLE)
    13. 10.13 Power-Up Characteristics
    14. 10.14 Pre-Biased Start-up
    15. 10.15 Remote Sense
    16. 10.16 Thermal Shutdown
    17. 10.17 Output On/Off Inhibit (INH)
    18. 10.18 Slow Start (SS/TR)
    19. 10.19 Overcurrent Protection
    20. 10.20 Synchronization (CLK)
    21. 10.21 Sequencing (SS/TR)
    22. 10.22 Programmable Undervoltage Lockout (UVLO)
    23. 10.23 Layout Considerations
    24. 10.24 EMI
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings(1)

over operating temperature range (unless otherwise noted)
MIN MAX UNIT
Input Voltage VIN, PVIN –0.3 20 V
INH/UVLO, PWRGD, RT/CLK, SENSE+ –0.3 6 V
ILIM, VADJ, SS/TR, STSEL, SYNC_OUT, ISHARE, OCP_SEL –0.3 3 V
Output Voltage PH –1.0 20 V
PH 10 ns Transient –3.0 20 V
VOUT –0.3 6 V
Source Current RT/CLK, INH/UVLO ±100 µA
PH current limit A
Sink Current PH current limit A
PVIN current limit A
PWRGD –0.1 2 mA
Operating Junction Temperature –40 125(2) °C
Storage Temperature –65 150 °C
Peak Reflow Case Temperature(3) 245(4) °C
Maximum Number of Reflows Allowed(3) 3(4)
Mechanical Shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 1500 G
Mechanical Vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) See the temperature derating curves in the Typical Characteristics section for thermal information.
(3) For soldering specifications, refer to the Soldering Requirements for BQFN Packages application note.
(4) Devices with a date code prior to week 14 2018 (1814) have a peak reflow case temperature of 240°C with a maximum of one reflow.