SLVS522R july   2004  – july 2023 LP2985 , LP2985A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Output Pulldown
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Noise Bypass Capacitor (CBYPASS)
      4. 8.1.4 Reverse Current
      5. 8.1.5 Power Dissipation (PD)
      6. 8.1.6 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ON/OFF Operation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Changes from Revision P (February 2022) to Revision Q (December 2022)

  • Changed Features sectionGo
  • Added last bullet to Applications sectionGo
  • Changed Description sectionGo
  • Changed Description column and added footnote to Pin Functions table Go
  • Changed condition statement and curve titles and added curves for new chip in Typical Characteristics sectionGo
  • Changed Overview sectionGo
  • Changed Functional Block Diagram figureGo
  • Changed Feature Description section and added subsectionsGo
  • Added Output Pulldown sectionGo
  • Changed Device Functional Modes section: changed Normal Operation section, added Device Functional Mode Comparison, Dropout Operation, and Disabled sections, and deleted Shutdown Mode sectionGo
  • Changed Application Information section: deleted previous information and added new subsectionsGo
  • Added Recommended Capacitor Types sectionGo
  • Added Input and Output Capacitor Requirements sectionGo
  • Added start-up behavior discussion to Noise Bypass Capacitor (CBYPASS) sectionGo
  • Added Reverse Current sectionGo
  • Added Power Dissipation (PD) sectionGo
  • Added Estimating Junction Temperature sectionGo
  • Changed LOW and HIGH pin voltages and deleted slew rate discussion from ON/OFF Operation sectionGo
  • Changed Application Curves sectionGo
  • Changed Layout Diagram figureGo
  • Added Device Nomenclature sectionGo