SNVSBU8A May   2021  – November 2021 LP5860

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Time-Multiplexing Matrix
      2. 8.3.2 Analog Dimming (Current Gain Control)
      3. 8.3.3 PWM Dimming
      4. 8.3.4 ON and OFF Control
      5. 8.3.5 Data Refresh Mode
      6. 8.3.6 Full Addressable SRAM
      7. 8.3.7 Protections and Diagnostics
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Program Procedure
      5. 9.2.5 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Device Functional Modes

Figure 8-13 Device Functional Modes

  • SHUTDOWN: The device enters into SHUTDOWN mode from all states on VCC power up or EN pin is low.
  • HARDWARE POR: The device enters into HARDWARE POR when Enable pin is high or VCC fall under VUVF causing UVLO=H from all states.
  • SOFTWARE RESET: The device enters into SOFTWARE RESET mode when VCC rise higher than VUVR with the time t > tPOR_H. In this mode, all the registers are reset. Entry can also be from any state when the RESET (register) = FFh or UVLO is low.
  • STANDBY: The device enters the STANDBY mode when Chip_EN (register) = 0. In this mode, device enters into low power mode, but the I2C/SPI are still available for Chip_EN only and the registers’ data are retained.
  • NORMAL: The device enters the NORMAL mode when 'Chip_EN' = 1 with the time t > tCHIP_EN.
  • THERMAL SHUTDOWN: The device automatically enters the THERMAL SHUTDOWN mode when the junction temperature exceeds 160°C (typical). If the junction temperature decreases below 145°C (typical), the device returns to the NORMAL mode.