SNVSBU3 March   2021 LP87702

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Parameters
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1  Step-Down DC/DC Converters
        1. 7.3.1.1 Overview
        2. 7.3.1.2 Transition Between PWM and PFM Modes
        3. 7.3.1.3 Buck Converter Load Current Measurement
      2. 7.3.2  Boost Converter
      3. 7.3.3  Spread-Spectrum Mode
      4. 7.3.4  Sync Clock Functionality
      5. 7.3.5  Power-Up
      6. 7.3.6  Buck and Boost Control
        1. 7.3.6.1 Enabling and Disabling Converters
        2. 7.3.6.2 Changing Buck Output Voltage
      7. 7.3.7  Enable and Disable Sequences
      8. 7.3.8  Window Watchdog
      9. 7.3.9  Device Reset Scenarios
      10. 7.3.10 Diagnostics and Protection Features
        1. 7.3.10.1 Voltage Monitorings
        2. 7.3.10.2 Interrupts
        3. 7.3.10.3 Power-Good Information to Interrupt, PG0, and PG1 Pins
          1. 7.3.10.3.1 PGx Pin Gated (Unusual) Mode
          2. 7.3.10.3.2 PGx Pin Operation in Continuous Mode
          3. 7.3.10.3.3 Summary of PG0, PG1 Gated, and Continuous Operating Modes
        4. 7.3.10.4 Warning Interrupts for System Level Diagnostics
          1. 7.3.10.4.1 Output Power Limit
          2. 7.3.10.4.2 Thermal Warning
        5. 7.3.10.5 Protections Causing Converter Disable
          1. 7.3.10.5.1 Short-Circuit and Overload Protection
          2. 7.3.10.5.2 Overvoltage Protection
          3. 7.3.10.5.3 Thermal Shutdown
        6. 7.3.10.6 Protections Causing Device Power Down
          1. 7.3.10.6.1 Undervoltage Lockout
      11. 7.3.11 OTP Error Correction
      12. 7.3.12 Operation of GPO Signals
      13. 7.3.13 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1 LP8770_map Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Application Components
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Buck Input Capacitor Selection
          3. 8.2.2.1.3 Buck Output Capacitor Selection
          4. 8.2.2.1.4 Boost Input Capacitor Selection
          5. 8.2.2.1.5 Boost Output Capacitor Selection
          6. 8.2.2.1.6 Supply Filtering Components
      3. 8.2.3 Current Limit vs Maximum Output Current
      4. 8.2.4 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

The performance of the LP87702 device depends greatly on the care taken in designing the printed circuit board (PCB). The use of low-inductance and low serial-resistance ceramic capacitors is strongly recommended, while proper grounding is crucial. Attention should be given to decoupling the power supplies. Decoupling capacitors must be connected close to the device and between the power and ground pins to support high peak currents being drawn from the system power rail while turning on the switching MOSFETs. Keep input and output traces as short as possible, because trace inductance, resistance, and capacitance can easily become the performance limiting items. The separate buck converter power pins VIN_Bx are not connected together internally. The VIN_Bx power connections shall be connected together outside the package using a power plane construction.