SNVSC48 October   2021 LP87745-Q1

ADVANCE INFORMATION  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Description (continued)
  6. 6Pin Configuration and Functions
  7. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  8. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Packaging Option Addendum
    2. 8.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • RXV|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.