SLVSIQ0 May   2025 LP8865C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4  Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adaptive Off-Time Current Mode Control
      2. 7.3.2 Setting LED Current
      3. 7.3.3 Internal Soft Start
      4. 7.3.4 Dimming Mode
        1. 7.3.4.1 PWM dimming
        2. 7.3.4.2 Analog dimming
      5. 7.3.5 Fault Protection
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LP8865CUQDGNRQ1 12V Input, 1A Output, 8-piece WLED Driver With Analog Dimming
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Output Capacitor Selection
          4. 8.2.1.2.4 Sense Resistor Selection
          5. 8.2.1.2.5 Other External Components Selection
      2. 8.2.2 LP8865CYQDGNRQ1 24V Input, 0.5A Output, 4-piece WLED Driver With PWM Dimming
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Inductor Selection
          2. 8.2.2.2.2 Input Capacitor Selection
          3. 8.2.2.2.3 Output Capacitor Selection
          4. 8.2.2.2.4 Sense Resistor Selection
          5. 8.2.2.2.5 Other External Components Selection
      3. 8.2.3 LP8865CWQDGNRQ1 24V Input, 2A Output, 4-piece WLED Driver With Analog Dimming
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Inductor Selection
          2. 8.2.3.2.2 Input Capacitor Selection
          3. 8.2.3.2.3 Output Capacitor Selection
          4. 8.2.3.2.4 Sense Resistor Selection
          5. 8.2.3.2.5 Other External Components Selection
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

Examples of a proper layout for boost topolgy, buck-boost topology and buck topology of LP8865C-Q1 family is shown below.

  • Creating a large GND plane for good electrical and thermal performance is important.
  • The VIN and GND traces should be as wide as possible to reduce trace impedance. Wide traces have the additional advantage of providing excellent heat dissipation.
  • Thermal vias can be used to connect the top-side GND plane to additional printed-circuit board (PCB) layers for heat dissipation and grounding.
  • The input capacitors must be located as close as possible to the IN pin and the GND pin.
  • The VCC capacitor should be placed as close as possible to VCC pin to ensure stable LDO output voltage.
  • The SW trace must be kept as short as possible to reduce parasitic inductance and thereby reduce transient voltage spikes. Short SW trace also reduces radiated noise and EMI.
  • Do not allow switching current to flow under the device.
  • The routing of CSN and CSP traces are recommended to be in parallel and kept as short as possible and placed away from the high-voltage switching trace and the ground shield.
  • The compensation capacitor must be placed as close as possible to COMP pin so as to prevent oscillation and system instability.