SNVSBD1A August 2020 – February 2021 LP8866S-Q1
PRODUCTION DATA
THERMAL METRIC(1) | Device | UNIT | |
---|---|---|---|
HTTSOP | |||
38-PIN | |||
RθJA | Junction-to-ambient thermal resistance(2) | 32.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 19.5 | |
RθJB | Junction-to-board thermal resistance | 8.8 | |
ΨJT | Junction-to-top characterization parameter | 0.3 | |
ΨJB | Junction-to-board characterization parameter | 8.9 | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.7 |