SLLS686C October   2005  – July 2021 MAX3221E

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics: Driver
    8. 6.8  Electrical Characteristics: Receiver
    9. 6.9  Electrical Characteristics: Auto-Power Down
    10. 6.10 Switching Characteristics: Driver
    11. 6.11 Switching Characteristics: Receiver
    12. 6.12 Switching Characteristics: Auto-Power Down
    13. 6.13 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS-232 Driver
      3. 8.3.3 RS-232 Receiver
      4. 8.3.4 RS-232 Status
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics: Receiver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3)
PARAMETERTEST CONDITIONSTYP(1)UNIT
tPLHPropagation delay time, low- to high-level outputCL = 150 pF, See Figure 7-3150ns
tPHLPropagation delay time, high- to low-level outputCL = 150 pF, See Figure 7-3150ns
tenOutput enable timeCL = 150 pF, RL = 3 kΩ, See Figure 7-4200ns
tdisOutput disable timeCL = 150 pF, RL = 3 kΩ, See Figure 7-4200ns
tsk(p)Pulse skew(2)See Figure 7-350ns
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH  – tPHL| of each channel of the same device.
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.