SBOS879D July   2017  – October 2019 MCP6291 , MCP6292 , MCP6294

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Low-Side Motor Control
      2.      Small-Signal Overshoot vs Load Capacitance
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: MCP6921
    2.     Pin Functions: MCP6292
    3.     Pin Functions: MCP6294
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: MCP6291
    5. 7.5 Thermal Information: MCP6292
    6. 7.6 Thermal Information: MCP6294
    7. 7.7 Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 2.4 V to 5.5 V
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Rail-to-Rail Output
      3. 8.3.3 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (January 2019) to D Revision

  • Added SOT-23 (8) (DDF) package to data sheetGo

Changes from B Revision (April 2018) to C Revision

  • Deleted SOT-23 package preview notation in Device Information tableGo
  • Added SC70 package to Device Information tableGo
  • Added DCK package information to Device Comparison TableGo
  • Deleted DBV package preview notation from Pin Configuration and Functions sectionGo
  • Added DCK package drawing and pin functions to Pin Configuration and Functions sectionGo
  • Added DBV (SOT-23) and DCK (SC70) thermal informationGo

Changes from A Revision (October 2017) to B Revision

  • Added DGK package to Thermal Information table Go

Changes from * Revision (July 2017) to A Revision

  • Deleted MCP6291 SC70, SOT-553, and SOIC packages from Device Information tableGo
  • Deleted MCP6292 WSON and VSSOP (10) packages from Device Information tableGo
  • Changed MCP6294 14-pin SOIC package from preview to production data in Device Information table Go
  • Deleted DCK, DRL, DSG, RTE and 8-pin D packages from Device Comparison table Go
  • Deleted DRL (SOT-533) package from MCP6291 pinout image and table in Pin Configuration and Functions section Go
  • Deleted MCP6291 DCK (SC70) and D (SOIC) package pinout drawings and pin information from Pin Configuration and Functions sectionGo
  • Deleted MCP6292 DSG (WSON) and DGS (VSSOP) package pinout drawings and pin table information in Pin Configuration and Functions section Go
  • Deleted package preview note from MCP6294 pinout drawing in Pin Configuration and Functions section Go
  • Added MCP6294 Thermal Information table Go